Item No
|
: |
|
Size
|
: |
|
| Packing |
: |
|
| PCB dimension |
: |
W20*D20~W550*D500mm |
| PCB thickness |
: |
0.5~4mm |
| Working table adjustment |
: |
±120mm Forward/backward, ±80mm Left/right |
| Temperature controlt |
: |
K-type Thermocouple, Close Cycle Controlled |
| PCB locating way |
: |
Outer |
| lower hot air heater |
: |
800W |
| upper hot ait heater |
: |
1200w |
| Bottom preheat far infrared |
: |
3600W |
| Power supply |
: |
Single-phase 220v,50/60Hz |
| BGA dimension |
: |
1*1~80*80mm |
| Min pitch of BGA ball |
: |
0.15mm |
| Placement precision |
: |
±0.01mm |
| Max BGA weight |
: |
80g |
| Machine dimension |
: |
L850*W750*H630 |